About Zack Rosen

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So far Zack Rosen has created 10 blog entries.


Radio Frequency Identification (RFID) is essential when you own large volumes of Returnable Transport Items (RTIs). Here are two BIG reasons why…

Up to 25% of RTIs are lost per year
Counterfeit RTIs are returned to your facility to be replaced or reconditioned. In most cases, you don’t even own the RFID.

High Cost

The costs associated […]

October 9th, 2017|Categories: 3D-MID, Blog, Laser Direct Structuring|Tags: , |

Plating on PEEK, Ultem, Nylon, and Acetal

New surface activation technology allows you to plate previously impossible to plate plastics like PEEK, Ultem, Nylon and Acetal without the use of chemical or mechanical etching. This process is perfect for connectors and replaces cadmium for military specification MTL-DTL-38999.

Benefits of Plating on PEEK, Ultem, Nylon and Acetal Over Traditional Plastics:

More strength (glass/carbon reinforced)

July 25th, 2017|Categories: Blog, Surface Activation|Tags: , , , , , |

3D-MIDs and Peanut Butter Cups

What can we learn about 3D-MIDs from Peanut Butter Cups?

A lot.

But first let’s go back to our childhood and look at the infamous Reese’s Peanut Butter Cup commercial. You know the one that shows how it all started.

Two guys, each one loves their snack of choice. One chocolate, the other peanut butter. Both have no […]

June 27th, 2017|Categories: 3D-MID, Blog|Tags: , , , , |

SelectConnect Technologies Publishes White Paper on Sensor Manufacturing


PALATINE, Illinois, USA, June 19, 2017 –SelectConnect Technologies has published the white paper, “Laser Direct Structuring for Sensor Manufacturing.” The white paper details how sensor technology employing laser direct structuring (LDS) results in reduced manufacturing costs, while increasing the physical strength and durability of a position sensor.

Millions of electronic components with complex geometries are manufactured […]

June 18th, 2017|Categories: News & Events||

SelectConnect Technologies Publishes White Paper on Laser Direct Structuring

PALATINE, Illinois, USA, April 5, 2017 –SelectConnect Technologies has published the white paper, “Trace Width and Space Limitations for Laser Direct Structuring.” The white paper details a study that was conducted to determine how close laser direct structuring (LDS) traces can be created and metallized without inducing over plating or bridging on PET/PBT material.

A geometric […]

April 4th, 2017|Categories: News & Events||

SelectConnect Technologies Launches 3Discussions™ Blog

PALATINE, Illinois, USA, March 23, 2017 –SelectConnect Technologies officially launched the blog, “3Discussions™” this week. With the objective of fostering discussions and collaboration throughout the supply chain, 3Discussions is dedicated to the advancement, applications and benefits of three-dimensional molded interconnect devices (3D-MID).

3Discussions was created in response to high industry demand for production-proven information on producing […]

March 22nd, 2017|Categories: News & Events||

Why a 3D-MID?

Today’s top innovations come from integrating new technologies such as 3D-MIDs into your devices or systems. Whether you are redesigning an existing system or creating something new 3D-MIDs need to be part of your design discussions. The reasons for this include:

Function integration. 3D-MID technology allows electrical, mechanical, optical and fluid functions to be integrated into smaller designs.
Miniaturization. With […]

March 20th, 2017|Categories: 3D-MID, Blog|Tags: , |

Selecting the Proper LDS Material

Without the proper selection of Laser Direct Structuring (LDS) materials from the beginning, your project could easily go from a hit to a headache. There are a number of important considerations when determining the proper base material of your Laser Direct Structuring project.

Among them are:

Thermal Expansion
Water Absorption
Mechanical Characteristics
Solderability (including laser or supersonic welding)

A […]

Major Corporate Expansion Completed

PALATINE, Illinois, USA, March 6, 2017 – Arlington Plating Company, the parent company of SelectConnect Technologies, is pleased to announce a major expansion at its Palatine, Illinois headquarters that has resulted in enhanced operations and production capabilities for both companies.

Specifically, the recent addition of a 35,000 square foot facility substantially grows the company’s campus to […]

March 8th, 2017|Categories: News & Events||

LDS vs. 2-Shot

The creation of integrated circuitry on plastic can be accomplished through several different processes. The two main processes are 2-shot injection molding and Laser Direct Structuring (LDS).

The creation of a 2-shot injection mold can be very expensive and once the mold is created, your circuitry pattern is set. Should you later decide to change […]