Radio Frequency Identification (RFID) is essential when you own large volumes of Returnable Transport Items (RTIs). Here are two BIG reasons why…

Up to 25% of RTIs are lost per year
Counterfeit RTIs are returned to your facility to be replaced or reconditioned. In most cases, you don’t even own the RFID.

High Cost

The costs associated […]

October 9th, 2017|Categories: 3D-MID, Blog, Laser Direct Structuring|Tags: , |

The Four R’s of Plastics Selective Metallization

When you selectively metallize circuitry on plastic, a 3 Dimensional Molded Interconnect Device or 3D-MID is created. The two main technologies to develop 3D-MIDs are Laser Direct Structuring (LDS) and the metallization of a 2-shot molded component.

The 4 R’s of Selective Metallization of Plastics include:

Reduce Weight: Plastics are half the weight and are strong enough to replace aluminum. Furthermore, the printed circuit board can be completely eliminated […]

Plating on PEEK, Ultem, Nylon, and Acetal

New surface activation technology allows you to plate previously impossible to plate plastics like PEEK, Ultem, Nylon and Acetal without the use of chemical or mechanical etching. This process is perfect for connectors and replaces cadmium for military specification MTL-DTL-38999.

Benefits of Plating on PEEK, Ultem, Nylon and Acetal Over Traditional Plastics:

More strength (glass/carbon reinforced)

July 25th, 2017|Categories: Blog, Surface Activation|Tags: , , , , , |

3D-MIDs and Peanut Butter Cups

What can we learn about 3D-MIDs from Peanut Butter Cups?

A lot.

But first let’s go back to our childhood and look at the infamous Reese’s Peanut Butter Cup commercial. You know the one that shows how it all started.

Two guys, each one loves their snack of choice. One chocolate, the other peanut butter. Both have no […]

June 27th, 2017|Categories: 3D-MID, Blog|Tags: , , , , |

“But It’s Always Been Done This Way!”

When you hold on to old technology because “it’s always been done this way,” we deny ourselves the opportunity to truly innovate.

The greatest technology shifts don’t come from small incremental changes within existing technologies, but rather from a total shift in how things are done. Often innovation results from someone taking on the challenge because others say it can’t be done.

Are you […]

May 23rd, 2017|Categories: Blog|Tags: , |

3D Components Drive Down Size, Weight, Complexity and Costs

3D-Molded Interconnect Devices (3D-MID) consist of circuit traces embedded onto molded thermoplastics to form electrical pathways and landings for surface mount components. Designing systems with 3D-MID components enable designers to reduce the size, weight, number of components and complexity, while decreasing assembly times and cost by requiring fewer components, wires and interconnects to assemble. Electronic components and chips […]

Why a 3D-MID?

Today’s top innovations come from integrating new technologies such as 3D-MIDs into your devices or systems. Whether you are redesigning an existing system or creating something new 3D-MIDs need to be part of your design discussions. The reasons for this include:

Function integration. 3D-MID technology allows electrical, mechanical, optical and fluid functions to be integrated into smaller designs.
Miniaturization. With […]

March 20th, 2017|Categories: 3D-MID, Blog|Tags: , |

Selecting the Proper LDS Material

Without the proper selection of Laser Direct Structuring (LDS) materials from the beginning, your project could easily go from a hit to a headache. There are a number of important considerations when determining the proper base material of your Laser Direct Structuring project.

Among them are:

Thermal Expansion
Water Absorption
Mechanical Characteristics
Solderability (including laser or supersonic welding)

A […]

LDS vs. 2-Shot

The creation of integrated circuitry on plastic can be accomplished through several different processes. The two main processes are 2-shot injection molding and Laser Direct Structuring (LDS).

The creation of a 2-shot injection mold can be very expensive and once the mold is created, your circuitry pattern is set. Should you later decide to change […]