2-Shot Injection Molding

The Four R’s of Plastics Selective Metallization

When you selectively metallize circuitry on plastic, a 3 Dimensional Molded Interconnect Device or 3D-MID is created. The two main technologies to develop 3D-MIDs are Laser Direct Structuring (LDS) and the metallization of a 2-shot molded component.

The 4 R’s of Selective Metallization of Plastics include:

Reduce Weight: Plastics are half the weight and are strong enough to replace aluminum. Furthermore, the printed circuit board can be completely eliminated […]

3D Components Drive Down Size, Weight, Complexity and Costs

3D-Molded Interconnect Devices (3D-MID) consist of circuit traces embedded onto molded thermoplastics to form electrical pathways and landings for surface mount components. Designing systems with 3D-MID components enable designers to reduce the size, weight, number of components and complexity, while decreasing assembly times and cost by requiring fewer components, wires and interconnects to assemble. Electronic components and chips […]

Selecting the Proper LDS Material

Without the proper selection of Laser Direct Structuring (LDS) materials from the beginning, your project could easily go from a hit to a headache. There are a number of important considerations when determining the proper base material of your Laser Direct Structuring project.

Among them are:

Thermal Expansion
Water Absorption
Mechanical Characteristics
Solderability (including laser or supersonic welding)

A […]

LDS vs. 2-Shot

The creation of integrated circuitry on plastic can be accomplished through several different processes. The two main processes are 2-shot injection molding and Laser Direct Structuring (LDS).

The creation of a 2-shot injection mold can be very expensive and once the mold is created, your circuitry pattern is set. Should you later decide to change […]