PALATINE, Illinois, USA, March 23, 2017 –SelectConnect Technologies officially launched the blog, “3Discussions™” this week. With the objective of fostering discussions and collaboration throughout the supply chain, 3Discussions is dedicated to the advancement, applications and benefits of three-dimensional molded interconnect devices (3D-MID).

3Discussions was created in response to high industry demand for production-proven information on producing […]

Electroless plating is the method for forming electro-mechanical traces on the laser defined structures or the double-shot molded component. The metallization sequence is electroless copper plating (100 to 600 micro inches), electroless nickel plating (50 to 100 micro inches) and optional immersion gold plating (3 to 8 micro inches).

The first step in the process is […]

3D MID applications are the focus of the automotive and medical device industry. In a 3D-MID, surface mount device components are normally on multiple levels.

Applications for 3D-MIDs are increasing due to the need to miniaturize, reduce costs and the wider availability of 3D-MID manufacturing service providers.

Common 3D MID Applications:

IV Regulators (medical)
Barometric pressure sensors (industrial)
Laptop antennas […]

Not long ago someone thought of combining circuits and plastic components. The result, 3 dimensional molded interconnects (3D MID), changed the way cell phone antennas are made today.

Today, cell phone antennas are no longer planer; reception isn’t dependent on your orientation to the tower.

You can get multiple antenna into smaller spaces because you have integrated […]