PALATINE, Illinois, USA, March 23, 2017 –SelectConnect Technologies officially launched the blog, 3Discussions™” this week. With the objective of fostering discussions and collaboration throughout the supply chain, 3Discussions is dedicated to the advancement, applications and benefits of three-dimensional molded interconnect devices (3D-MID).

3Discussions was created in response to high industry demand for production-proven information on producing laser direct structuring (LDS) and 2-shot molding on 3D-MID components. Postings on material selection, consultative design, prototyping and other relevant areas will continue to be posted or are planned. Widely used in automotive, antenna, aerospace/military, security shields and sensor applications, MID market size is forecast to reach USD 629.5 million by 2023.*

Richard Macary, President of SelectConnect Technologies, said, “MIDs continue to redefine a diversity of market applications by delivering highly effective, low-cost mechanical electrical designs, smaller footprints and reduced assembly time. 3Discussions provides the perfect platform for SelectConnect Technologies and our customers to share knowledge and perspectives to drive innovation.”

Post your questions and comments today, by visiting selectconnecttech.com/blog.

About SelectConnect Technologies

SelectConnect Technologies specializes in the production of three-dimensional molded interconnect devices (3D-MID), offering both laser direct structuring (LDS) and 2-shot injection capabilities. Working with LPKF since 2010, the company has produced thousands of laser direct structured components for a wide range of applications. With expertise in electroless metallization, SelectConnect also produces molded interconnect device plating to construct circuitry with the comparable function and performance of a printed circuit board.

A division of Arlington Plating Company, SelectConnect Technologies is an ISO-9001:2008 company. For more information, please contact [email protected] or visit selectconnecttech.com.

*Global Market Insights, Inc.