Without the proper selection of Laser Direct Structuring (LDS) materials from the beginning, your project could easily go from a hit to a headache. There are a number of important considerations when determining the proper base material of your Laser Direct Structuring project.

Among them are:

  • Thermal Expansion
  • Water Absorption
  • Mechanical Characteristics
  • Solderability (including laser or supersonic welding)

A number of series materials or thermoplastics are available to produce injection molded MIDs (Molded Interconnect Devices) for the LPKF-LDS method. With a wide variety of thermoplastic materials available, designers have many choices to optimize part performance.

These LDS materials are suitable for a large number of different applications thanks to their broad spectrum of properties:

PA6/6T (semi-aromatic polyamide), based on Ultramid® (BASF AG)

  • Very high thermal shape stability, suitable for reflow soldering (also with lead-free solder)
  • Very good mechanical properties

Thermoplastic polyester (PBT, PET and blends), based on Pocan® (LANXESS)

  • Very good mechanical and electrical properties
  • Very high thermal shape stability with addition of PET

Crosslinked PBT (polybutylenterephathalate), based on Vestodur® (Evonik)

  • Migration-resistant fire protection equipment (VO – 0.4 mm after UL94)
  • Irradiation cross linkable for high temperature resistance (all soldering processes)

LCP (Liquid Crystal Polymer), based on Vectra® (Ticona GmbH)

  • High heat resistance
  • Excellent flow properties for thin wall molding
  • Excellent dimensional stability under thermal stress
  • Suitable for reflow soldering with lead free solder

PC/ABS (polycarbonate / acrylonitrile / butadiene / styrene / styrol)*

  • Very good processability
  • Very good surface properties
  • Very good mechanical properties
  • High impact strength

Everything starts with a good understanding of your project and a discussion with an LDS expert. Learn more. Connect with an Engineer today.