3D-Molded Interconnect Devices (3D-MID) consist of circuit traces embedded onto molded thermoplastics to form electrical pathways and landings for surface mount components. Designing systems with 3D-MID components enable designers to reduce the size, weight, number of components and complexity, while decreasing assembly times and cost by requiring fewer components, wires and interconnects to assemble. Electronic components and chips may be attached directly to the 3D-MID by soldering or wire bonding to make better use of space.
A wide range of engineering grade resins are available that support reflow soldering of components directly on the MID. To view a list, click here.
Compared to 2-dimensional printed circuit boards or a flexible circuit, a 3D-MID can take the shape of a molded component allowing circuit paths to be created on non-conductors used for the enclosure, chassis, and device structure. The electrical path is patterned in true 3D following the contour of the molded component.
Two processes are commonly used to manufacture 3D-MID, the two-shot process and Laser Direct Structuring (LDS). Both two-shot and the LDS process use an electroless plating process that commonly includes electroless copper, electroless nickel, and immersion gold.
To learn about 3D-MID and our consultative services, contact us today!