When you selectively metallize circuitry on plastic, a 3 Dimensional Molded Interconnect Device or 3D-MID is created. The two main technologies to develop 3D-MIDs are Laser Direct Structuring (LDS) and the metallization of a 2-shot molded component.
 

The 4 R’s of Selective Metallization of Plastics include:

Reduce Weight: Plastics are half the weight and are strong enough to replace aluminum. Furthermore, the printed circuit board can be completely eliminated […]